Delivery Capacity
| Rigidum Board Capacity | |
| Numerus layers: | 1-42 layers |
| Material: | F4 \ High TG F4 \ Plumbum Free Material \ Cem1 \ CEM3 \ Aluminium \ Metal Core \ PTTFE \ Rogers |
| De layer cu crassitudine: | 1-6oz |
| Interiorem layer cu crassitudine: | 1-4OZ |
| Maxime processus area: | DCX * 1100mm |
| Minimum Board Crassitudo: | II layers 0.3mm (12mil) IV layers 0.4mm (16mil) VI layers 0.8mm (32mil) VIII layers 1.0mm (40mil) X layers 1.1mm (44mil) XII layers 1.3mm (52mil) XIV layers 1.5mm (59mil) XVI layers 1.6mm (63mil) |
| Minimum Width: | 0.076mm (3mil) |
| Minimum spatium: | 0.076mm (3mil) |
| Minimum foraminis Size (Final foraminis): | 0.2mm |
| Ratio aspect: | X: I |
| EXERCITATIO foraminis Location: | 0.2-0.65mm |
| EXERCITATIO tolerantia: | + \ - 0.05mm (2mil) |
| PTH TOLERATIO: | Φ0.2-1.6mm + \ - 0.075mm (3mil) Φ1.6-6.3mm + - - 0.1mm (4mil) |
| NPth Tolerantia: | Φ0.2-1.6mm + \ - 0.05mm (2mil) Φ1.6-6.3mm + \ - 0.05mm (2mil) |
| Consummare Board tolerantia: | Crassitudo <0.8mm, tolerantia, +/- 0.08mm |
| 0.8mm≤thickness≤6.5mm, tolerantia +/- X% | |
| Minimum soldermask pontem: | 0.076mm (3mil) |
| Torquens et tendentes: | ≤0.75% min0.5% |
| Raneg TG: | 130-215 ℃ |
| Impedance tolerantia: | +/- X%, min +/- V% |
| Superficies curatio:
| Hasl, LF Hasl |
| BMPERIO Aurum, Flash Aurum, Aurum Digitus | |
| Immersionem argentum immersionem stagni, osp | |
| Selectivam Aurum Plantis, Aurum Crassitudo usque ad 3um (120U ") | |
| Carbon Print, Peelable S / M, Enepig | |
| Aluminium Board Capacity | |
| Numerus layers: | Unum iacuit, duplex stratis |
| Maximum Board Location: | MD * 600mm |
| Board Crassitudo: | 0.5-3.0mm |
| Aeris crassitudine: | 0.5-4oz |
| Minimum foraminis Location: | 0.8mm |
| Minimum Width: | 0,1mm |
| Minimum spatium: | 0.12mm |
| Minimum PAD Size: | X Micron |
| Superficiem metam: | Hasl, OSS, enig |
| Flavium: | Cnc, Punching, V-Conscidisti |
| Equipement: | Universalis |
| Volantem PROBUS Aperta / Short Tester | |
| Princeps virtutis microscopium | |
| Solderability testing ornamentum | |
| Cortices vires testis | |
| High Volt Open & Short Tester | |
| Crucis section CUMATIUM ornamentum cum Polisher | |
| FPC capacity | |
| Layers: | 1-8 layers |
| Board Crassitudo: | 0.05-0.5mm |
| Aeris crassitudine: | 0.5-3oz |
| Minimum Width: | 0.075mm |
| Minimum spatium: | 0.075mm |
| In per foraminis Location: | 0.2mm |
| Minimum laser foraminis Location: | 0.075mm |
| Minimum Punching Software Size: | 0.5mm |
| Soldermask tolerantia: | + \ - 0.5mm |
| Minimum fuso dimensionem tolerantia: | + \ - 0.5mm |
| Superficiem metam: | Hasl, LF Hasl, immersionem argentum, immersionem aurum, aurum, osp |
| Flavium: | Punching, laser, Conscidisti |
| Equipement: | Universalis |
| Volantem PROBUS Aperta / Short Tester | |
| Princeps virtutis microscopium | |
| Solderability testing ornamentum | |
| Cortices vires testis | |
| High Volt Open & Short Tester | |
| Crucis section CUMATIUM ornamentum cum Polisher | |
| Rigidos & Flit | |
| Layers: | 1-28 layers |
| Material Type: | P. IV (High TG, Halogen Free, High Frequency) Ptfe, BT, Getek, Aluminium Base, Aeris Base, KB, Nanya, Shengyi, Iteq, ILM, Isola, Nelco, Rogers, Arlon |
| Board Crassitudo: | 6-240MIL / 0.15-6.0mm |
| Aeris crassitudine: | 210um (6oz) pro interiore layer 210um (6oz) ad exterius layer |
| Min mechanica EXERCITATIO Size: | 0.2mm / 0.08 " |
| Ratio aspect: | II, I |
| Max Panel Size: | Sigle latus aut duplex lateribus: 500mm * 1200mm |
| Multilayer layers: 508mm x 610mm (XX "x XXIV") | |
| Min linea width / spatium: | 0.076mm / 0.076mm (0.003 "/ 0.003") / 3mil / 3mil |
| Per foraminis type: | Caeci / buried / SUPERGESTUS (Vop, VIP ...) |
| HDI / microvia: | Sic |
| Superficiem metam: | Hasl, LF Hasl |
| BMPERIO Aurum, Flash Aurum, Aurum Digitus | |
| Immersionem argentum immersionem stagni, osp | |
| Selectivam Aurum Plantis, Aurum Crassitudo usque ad 3um (120U ") | |
| Carbon Print, Peelable S / M, Enepig | |
| Flavium: | Cnc, Punching, V-Conscidisti |
| Equipement: | Universalis |
| Volantem PROBUS Aperta / Short Tester | |
| Princeps virtutis microscopium | |
| Solderability testing ornamentum | |
| Cortices vires testis | |
| High Volt Open & Short Tester | |
| Crucis section CUMATIUM ornamentum cum Polisher | |
